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KDCP-200 is a multi-functional Epoxy Resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation Epoxy Resins, such as o-cresol novolac Epoxy Resin(YDCN type) or biphenyl type Epoxy Resin. This product can be substituted for YDCN and biphenyl type Epoxy Resin for preparing EMC with excellent performance in SMD.
Epoxemex was founded in 1994 and in 1997 we began our first distribution partnership with KUKDO CHEMICAL. We are dedicated to the commercialization, distribution and production of raw materials for paints and coatings, inks, adhesives, construction, rubber, plastics, composites, cosmetics and chemical industry in general.
