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KDCP-150 is a multi-functional Epoxy Resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation Epoxy Resins, such as o-cresol novolac Epoxy Resin(YDCN type) or biphenyl type Epoxy Resin. This product can be substituted for YDCN and biphenyl type Epoxy Resin for preparing EMC with excellent performance in SMD.