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Epoxy Resins
/
Dielectric Resins
UM HV
Description:
Modified high viscosity liquid epoxy resin, primarily used for electrical encapsulation.
Properties:
High Viscosity Epoxy Resin for Electrical Encapsulation
Applications:
- ENCAPSULATION OF ELECTRICAL CIRCUITS OR COILS
- IN COMBINATION WITH INERT FILLERS (CALCIUM CARBONATE
- TALCS OR SILICA SAND).
|
VISCOSITY
cps@25°C
|
DENSITY
g/cm³@25°C
|
COLOR
Gardner
|
EEW
% En Peso
|
|
2,700 - 3,200 |
1.13 - 1.17 |
1 Max |
260 - 280 |
VISCOSITY
cps@25°C
2,700 - 3,200
DENSITY
g/cm³@25°C
1.13 - 1.17
Values shown are for reference only. Final properties may vary depending on batch, application conditions and formulation. Always consult the current technical data sheet before use.
Images are for illustrative purposes only, and the product presentation, packaging, or appearance may vary depending on availability and the manufacturer's specifications.