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Epoxy Resins
/
Dielectric Resins
UM HV
Description:
Modified high viscosity liquid epoxy resin, primarily used for electrical encapsulation.
Properties:
High Viscosity Epoxy Resin for Electrical Encapsulation
Applications:
- ENCAPSULATION OF ELECTRICAL CIRCUITS OR COILS
- IN COMBINATION WITH INERT FILLERS (CALCIUM CARBONATE
- TALCS OR SILICA SAND).
|
VISCOSITY
cps@25°C
|
DENSITY
g/cm³@25°C
|
COLOR
Gardner
|
EEW
% En Peso
|
|
2,700 - 3,200 |
1.13 - 1.17 |
1 Max |
260 - 280 |
VISCOSITY
cps@25°C
2,700 - 3,200
DENSITY
g/cm³@25°C
1.13 - 1.17
Values shown are for reference only. Final properties may vary depending on batch, application conditions and formulation. Always consult the current technical data sheet before use.