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Epoxy Resins / Dielectric Resins

UM

Description:

Modified low viscosity liquid epoxy resin, primarily used for electrical encapsulation.

Properties:

Epoxy Resin for Electrical Encapsulation

Applications:

ENCAPSULATION OF ELECTRICAL CIRCUITS OR COILS
IN COMBINATION WITH INERT FILLERS (CALCIUM CARBONATE
TALCS OR SILICA SAND).

VISCOSITY cps@25°C	DENSITY g/cm³@25°C	COLOR Gardner	EEW % En Peso
700 - 900	1.14 - 1.17	Transparente	230 - 250

VISCOSITY

cps@25°C

700 - 900

DENSITY

g/cm³@25°C

1.14 - 1.17

COLOR

Gardner

Transparente

EEW

% En Peso

230 - 250

Values shown are for reference only. Final properties may vary depending on batch, application conditions and formulation. Always consult the current technical data sheet before use.
Images are for illustrative purposes only, and the product presentation, packaging, or appearance may vary depending on availability and the manufacturer's specifications.

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Description:

Properties:

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