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Epoxy Resins / Dielectric Resins

UM

Description:

Modified low viscosity liquid epoxy resin, primarily used for electrical encapsulation.

Properties:

Epoxy Resin for Electrical Encapsulation

Applications:

ENCAPSULATION OF ELECTRICAL CIRCUITS OR COILS
IN COMBINATION WITH INERT FILLERS (CALCIUM CARBONATE
TALCS OR SILICA SAND).

VISCOSITY cps@25°C	DENSITY g/cm³@25°C	COLOR Gardner	EEW % En Peso
700 - 900	1.14 - 1.17	Transparente	230 - 250

VISCOSITY

cps@25°C

700 - 900

DENSITY

g/cm³@25°C

1.14 - 1.17

COLOR

Gardner

Transparente

EEW

% En Peso

230 - 250

Values shown are for reference only. Final properties may vary depending on batch, application conditions and formulation. Always consult the current technical data sheet before use.

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Description:

Properties:

Applications:

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